胶黏剂
LED encapsulant --COB appilcation
Category
LED encapsulant
Features
Excellent heat resistant property
Good thermal and light stability
Excellent adhesion to metal and PPA
Excellent yellowing resistant property
Application
Apply to COB encapsulation
Product Specification
Grades | PS-5025 | PS-5028 | PS-5029 |
Mixing Ratio | 1:10 | 10:1 | 1:10 |
Viscosity | 3000 | 2000 | 2000 |
Refractive Index | 1.4 | 1.4 | 1.4 |
Shore Hardness | D75 | A67 | D60 |
Tensile strength /MPa | 13.0 | 3.0 | 6.0 |
Elongation Rate /% | 30.0 | 45.0 | 45.0 |
Light transmittance /% (450nm) | 95 (1mm) | 98（1mm） | 97（1mm） |
Feature | -Good adhesion to metals, chips and other substrates -Good process ability -High reflectivity | ||
Application | Encapsulation for LED backlight components for display, Auto | ||
